Standalone
Three-axis standalone prealigners for 45mm to 480mm substrates of any transparency, featuring single-unit handling of objects of multiple sizes, chuck- and pin-load modes, high precision options, and more.
Embedded
Single-axis embedded prealigners for 45mm to 470mm objects of any transparency in high speed wafer transfer systems featuring easy integration with market-available robots and a variety of options.
Edge Handling
Innovative autonomous devices featuring Passive Edge Contact with zero gripping force and no wafer stress - an alternative to edge-gripping technology - for handling of objects 75mm - 300mm.
Fast Swap
High-throughput prealigners featuring Fast Swap functionality based on a proprietary design which allows for wafer chuck loading below the pin level.
Custom
Solutions utilizing Logosol's prealigner technology for applications with special requirements, including vacuum, dual layer, ultra thin, and warped substrate handling.
Ordering Guide
All standard prealigner options for Standalone, Embedded, and Edge Handling models.